Engineer cooling for AI: From two-phase innovation to flexible infrastructure
Across three episodes, we’ll look at why two-phase direct-to-chip cooling is attracting growing interest, how heat rejection is changing alongside higher-density AI deployments, and why flexibility is becoming a priority when designing cooling infrastructure for the future.
September 2, 2026
9:00 AM EDT: Two-phase cooling comes of age
10:00 AM EDT: Maximizing cooling efficiency beyond the rack
11:00 AM EDT: Building flexibility into AI-ready cooling